prBAS EN IEC 60068-2-83:2025
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
General information
Status:Project
Number of pages:78
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:2.
Realization date:31.10.2025
Forseen date for next stage code:03.11.2025
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
19.040, Environmental testing
31.190, Electronic component assemblies
31.190, Electronic component assemblies
Abstract
<!-- NEW! -->IEC 60068-2-83:2025 is available as <a href="https://webstore.iec.ch/publication/107639">IEC 60068-2-83:2025 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60068-2-83:2025 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder paste. Data obtained by these methods are not intended to be used as absolute quantitative data for pass/fail purposes.
NOTE Different solderability test methods for SMD are described in IEC 60068‑2‑58 and IEC 60068‑2‑69. IEC 60068‑2‑58 specifies visual evaluation using solder bath and reflow method, IEC 60068‑2‑69 specifies wetting balance evaluation using solder bath and solder globule method.
This edition includes the following significant technical change with respect to the previous edition:
a) revise Clause 5 to align with that in IEC 60068‑2‑20:2021.
Lifecycle
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Original document and degree of correspondence
EN IEC 60068-2-83:2025, identical
IEC 60068-2-83:2025, identical
Relation to BAS standards
Work material
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