prBAS EN IEC 60749-37:2026
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
General information
Status:Project
Number of pages:45
Adoption method:Proglašavanje
Language:engleski,francuski
Edition:2.
Realization date:19.11.2025
Forseen date for next stage code:15.01.2026
Technical committee:BAS/TC 64, VS2 - Electrotechnical standardization
ICS:
31.080.01, Semiconductor devices in general
Abstract
<!-- NEW! -->IEC 60749-37:2022 is available as <a href="https://webstore.iec.ch/publication/79480">IEC 60749-37:2022 RLV</a> which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.</br></br>IEC 60749-37:2022 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test. This edition includes the following significant technical changes with respect to the previous edition:
- correction of a previous technical error concerning test conditions;
- updates to reflect improvements in technology.
Lifecycle
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Original document and degree of correspondence
EN IEC 60749-37:2022, identical
IEC 60749-37:2022, identical
Relation to BAS standards
Work material
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