nsBAS EN IEC 60286-3:2024
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
General information
Status:Project
Number of pages:64
Adoption method:Proglašavanje
Language:engleski
Edition:1.
Realization date:18.03.2024
Forseen date for next stage code:12.05.2024
Technical committee:BAS/TC 15, Electromagnetic compatibility
ICS:
31.020, Electronic components in general
31.240, Mechanical structures for electronic equipment
31.240, Mechanical structures for electronic equipment
Abstract
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Lifecycle
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Original document and degree of correspondence
EN IEC 60286-3:2022, identical
IEC 60286-3:2022, identical
Relation to BAS standards
Work material
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